Semiconductors: The Innovations Making Chips More Efficient

Published on September 29, 2026

The semiconductor market is projected to grow from $775B in 2024 to $1.6T by 2030, a 13% CAGR, according to McKinsey.

Semiconductors are fundamental to modern electrification, powering everything from EVs and renewable energy systems to heat pumps, data centers and industrial equipment. That makes chip efficiency a Climate Tech question: gains in how chips are designed, made and recovered carry through to every system that runs on them.

But chip production is resource-intensive, requiring significant amounts of energy, ultrapure water and specialized materials. As demand for chips rises, innovation is increasingly focused on improving both chip efficiency and the sustainability of chip manufacturing.

The semiconductor market at a glance

Metric Value
Market size, 2024 $775B
Market size, 2030 $1.6T
CAGR, 2024–2030 13%
Source: McKinsey, base-case scenario.

Where is semiconductor innovation happening?

Innovation spans the semiconductor lifecycle, from design and materials to manufacturing and end-of-life.

Innovation pathway Key technologies Focus
Semiconductor design Chip design & modeling software Lower power use, smaller chips, fewer redesigns
Semiconductor materials SiC, GaN, gallium oxide, diamond Higher efficiency and power handling
Low-impact manufacturing Water management, wastewater treatment, quality control, wafer reuse Lower resource use and waste
End-of-life Material recovery, component reuse Recover materials and extend component life

1. Semiconductor design

Chip design determines much of a semiconductor’s eventual performance and resource requirements.

Design software can model different architectures before manufacturing, helping optimize power consumption, chip size and performance while reducing costly redesigns. AI-powered electronic design automation is also being used to explore large design spaces and optimize power, performance and area.

The challenge is balancing efficiency improvements with reliability, performance and cost.

2. New semiconductor materials

Silicon remains dominant, but alternatives can perform better under demanding power and temperature conditions.

Material Potential Key hurdle
Silicon carbide (SiC) High-voltage and high-temperature applications, including EVs and grid equipment Cost and packaging limitations
Gallium nitride (GaN) Fast switching and smaller, more efficient power systems Cost, reliability and higher-power applications
Gallium oxide Very high-voltage applications Thermal management
Diamond Ultra-high-power, high-temperature applications Wafer production and conductivity

SiC and GaN are already commercially deployed in several applications, while gallium oxide and diamond remain at earlier stages of development. The U.S. Department of Energy identifies higher-voltage operation, manufacturing scale-up and thermal limitations among the areas requiring further development for wide-bandgap materials.

3. Making chip manufacturing less resource-intensive

Semiconductor manufacturing itself is becoming a target for innovation. Fabs require large quantities of water, energy and chemicals, with resource use increasing as chip manufacturing becomes more complex.

Water management technologies focus on recovering and reusing ultrapure water through improved cleaning cycles, closed-loop systems and advanced treatment, in line with industry guidance on water reuse in semiconductor processing.

Wastewater treatment targets contaminants including PFAS, solvents and metals, using advanced separation and emerging destruction technologies. PFAS treatment is particularly challenging because of the persistence of these compounds.

Quality control uses inspection and metrology to identify defects earlier, improving yield and reducing wasted materials and resources.

Wafer reuse restores used test wafers through processes such as stripping, polishing and cleaning so they can be used again.

Together, these technologies target four major areas of impact: water, energy, materials and waste.

4. What happens at end-of-life?

Innovation is also emerging after semiconductor components leave the factory.

Material recovery aims to extract valuable inputs such as silicon, gallium, indium and germanium from discarded semiconductor components.

Component reuse focuses on recovering functioning chips and processors, testing and reconditioning them for further use.

Both approaches face challenges around separation, purity, compatibility and reliability.

How mature are these solutions?

The technologies tracked on the Net0 Platform span the commercialization curve.

Maturity Examples
Full Commercial Readiness Semiconductor design, SiC, GaN, water management, quality control, wafer reuse
Deployment & Scale-Up Gallium oxide, diamond, wastewater treatment, component reuse
Validation & Prototyping Semiconductor material recovery

What could slow adoption?

Several barriers cut across the sector:

Barrier Challenge
Performance New solutions must match established technologies
Scale-up Semiconductor manufacturing requires extensive qualification
Cost New technologies compete with mature processes and equipment
Materials Some specialized inputs have concentrated supply chains
Geography Semiconductor production remains concentrated across a limited number of regions

For new materials and manufacturing technologies in particular, commercial adoption depends on demonstrating performance at production scale while controlling costs and maintaining reliability.

The bigger picture

Semiconductors enable many of the technologies driving electrification and energy efficiency, but their own production carries a significant resource footprint.

That is creating opportunities across the lifecycle, from more efficient chip designs and advanced materials to water recovery, manufacturing optimization and end-of-life solutions.

For a look at the companies building these innovations, read Semiconductor Startups to Watch.

OVER 400 SEMICONDUCTOR COMPANIES TRACKED
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